FoilMet ® ‐Interconnect: Busbarless, electrically conductive adhesive‐free, and solder‐free aluminum interconnection for modules with shingled solar cells

The investigation of novel cell-to-cell interconnection methods has gained importance with the increase wafer sizes. Shingling (i.e., overlapping) solar cells is not only a solution for smaller but also chance to output power density by (i) increasing active cell area within module, (ii) decreasing shading losses, and (iii) reducing electrical losses. Replacing commonly used expensive materials such as silver in cell's electrodes electrically conductive adhesive increases attractiveness shingled interconnection. This article introduces FoilMet®-Interconnect, an approach using laser-welded aluminum foil, shingling presents two solutions configuration. With production foil-based shingle strings modules, saving 36.7% silver, proof concept was successful. In subsequent measurements, efficiency ηFoilMet = (21.0 ± 0.2)% achieved three cell. Temperature cycle tests after encapsulation indicate applicability durability approach.